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MIC2800 Datasheet(PDF) 17 Page - Microchip Technology |
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MIC2800 Datasheet(HTML) 17 Page - Microchip Technology |
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17 / 32 page ![]() 2017-2023 Microchip Technology Inc. and its subsidiaries DS20005839C-page 17 MIC2800 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. 3.1 LOWQ The LOWQ pin provides a logic level control between the internal PWM mode and the low noise linear regulator mode. With LOWQ pulled low (<0.2V), quiescent current of the device is greatly reduced by switching to a low noise linear regulator mode that has a typical IQ of 20 µA (LDO2 ON only). In LowQ mode the LDO output can deliver 60 mA of current to the output. By placing LOWQ high (>1V), the device transitions into a constant frequency PWM buck regulator mode. This allows the device the ability to efficiently deliver up to 600 mA of output current at the same output voltage, and to support load transients generated by processor activity. LOWQ mode also limits the output load of both LDO1 and LDO2 to 10 mA. The ESD protection of the LOWQ pin is free from clamping diodes to the input supply rails, therefore the LOWQ signal can be driven by host I/Os under backup power domains without the risk of parasitic leakage, even if the main power to the MIC2800 is removed. 3.2 BIAS The BIAS pin supplies the power to the internal control and reference circuitry. The bias is powered from AVIN through an internal 6Ω resistor. A small 0.1 µF ceramic capacitor is required for bypassing. 3.3 SGND Signal ground (SGND) is the ground path for the biasing and control circuitry. The current loop for the signal ground should be as small as possible. 3.4 PGND Power ground (PGND) is the ground path for the high current PWM mode. The current loop for the power ground should be as small as possible. TABLE 3-1: PIN FUNCTION TABLE Pin Number 16-Pin QFN Pin Name Description 1LOWQ LOWQ Mode. Active Low Input. Logic High = Full Power Mode; Logic Low = LOWQ Mode; Do not leave floating. 2 BIAS Internal circuit bias supply. It must be decoupled to signal ground with a 0.1 µF capacitor and should not be loaded. 3 SGND Signal ground 4 PGND Power ground 5 SW Switch (Output): Internal power MOSFET output switches. 6VIN Supply Input – DC/DC. Must be tied to PIN7 externally. 7VIN Supply Input – LDO2. Must be tied to PIN6 externally. 8 LDO2 Output of LDO regulator 2. 9 FB Feedback. Input to the error amplifier for DC/DC converter. For fixed output voltages connect directly to VOUT and an internal resistor network sets the output voltage. 10 LDO LDO Output: Connect to VOUT of the DC/DC for LOWQ mode operation. 11 LDO1 Output of LDO regulator 1. 12 POR Power-on Reset Output: Open-drain output. Active low indicates an output undervoltage condition on either one of the three regulated outputs. 13 CSET Delay Set Input: connect external capacitor to GND to set the internal delay for the POR output. When left open, there is a minimum delay. This pin cannot be grounded. 14 CBYP Reference Bypass: connect external 0.1 µF to GND to reduce output noise. May be left open. 15 EN1 Enable Input (DC/DC and LDO1). Active High Input. Logic high = On; Logic low = Off; do not leave floating. 16 EN2 Enable Input (LDO 2). Active High Input. Logic high = On; Logic low = Off; do not leave floating. |
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