5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VIN

Continuous input voltage (Legacy chip)

–0.3

30

V

Continuous input voltage (New chip)

–0.3

42

VOUT

Output voltage

–0.3

39

VSHDN

SHUTDOWN input voltage (Legacy chip)

–1.5

30

SHUTDOWN input voltage (New chip)

–0.3

42

VERROR

ERROR comparator output voltage (Legacy chip) (2)

–1.5

30

ERROR comparator output voltage (New chip)(2)

–0.3

39

VFDBK

FEEDBACK input voltage (Legacy chip)(2) (3)

–1.5

30

FEEDBACK input voltage (New chip)(2) (3)

–0.3

5

VTAP

Internal resistor divider (fixed voltage option only) (New Chip)

–0.3

5

VSENSE

Output voltage sense (fixed voltage option only) (New Chip)

–0.3

5

Tstg

Storage temperature

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

Can exceed input supply voltage.

(3)

If load is returned to a negative power supply, the output must be diode clamped to GND.

5.2 ESD Ratings

VALUE

(Legacy

Chip)

VALUE

(New Chip)

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per AEC Q100-002(1)

±2000

±3000

V

Charged-device model (CDM), per AEC V

Q100-011

All pins

±1000

±1000

Charged-device model (CDM), per AEC V

Q100-011

Corner pins

±1000

±1000

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

LP2951-Q1

SLVSAW6H – JUNE 2011 – REVISED NOVEMBER 2024

www.ti.com

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