5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

Input voltage

2.0

30

V

VEN

Enable voltage

0

30

VOUT

Output voltage

1.2

30

IL

Output current

0

100

mA

CL

Output capacitor(1)

1

2.2

100

µF

CL ESR

Output capacitor ESR (Legacy chip)

30m

5

Ω

Output capacitor ESR (New chip)

0

2

CIN

Input capacitor

1

µF

CFF

Feed-forward capacitor (optional(2), for adjustable device only)

10

pF

IFB_DIVIDER

Feedback divider current(2) (adjustable device only)

12

µA

TJ

Junction temperature

–40

125

°C

(1)

Effective output capacitance of 0.5µF minimum required for stability.

(2)

CFF required for stability if the feedback divider current < 12µA. Feedback divider current = VOUT / (R1 + R2). See the Feed-Forward

Capacitor (CFF) section for details.

5.4 Thermal Information

THERMAL METRIC(1) (2)

Legacy Chip

New Chip

UNIT

D

DRG

D

DRG

8 PINS

8 PINS

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

121.6

55.7

123

48.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

69.8

66.5

67.8

60.4

°C/W

RθJB

Junction-to-board thermal resistance

61.9

30.2

70.7

22.4

°C/W

ΨJT

Junction-to-top characterization parameter

22.2

1.1

18.0

1.7

°C/W

ΨJB

Junction-to-board characterization parameter

69.8

30.4

69.8

22.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

10

n/a

3.3

°C/W

(1)

The thermal data is based on the JEDEC standard high K profile,JESD 51-7. Two-signal, two-plane, four-layer board with 2-oz. copper.

The copper pad is soldered to the thermal land pattern. Also, correct attachment procedure must be incorporated.

(2)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

5.5 Electrical Characteristics (Both Legacy and New Chip)

VIN = VOUT (nominal) + 1V, IL = 100µA, CL = 1µF (for new chip) and CL = 2.2µF (for legacy chip),

FEEDBACK tied to VTAP, OUTPUT tied to SENSE, VSHUTDOWN ≤ 0.7V

PARAMETER

TEST CONDITIONS

TJ

MIN

TYP

MAX UNIT

3.3-V VERSION

Output voltage

IL = 100µA

Legacy chip

25°C

3.267

3.3

3.333

V

–40°C to

125°C

3.234

3.3

3.366

New chip

25°C

3.2868

3.3 3.3132

–40°C to

125°C

3.2736

3.3 3.3264

5-V VERSION

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LP2951-Q1

SLVSAW6H – JUNE 2011 – REVISED NOVEMBER 2024

Copyright © 2024 Texas Instruments Incorporated

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