5.5 Electrical Characteristics (Both Legacy and New Chip) (continued)

VIN = VOUT (nominal) + 1V, IL = 100µA, CL = 1µF (for new chip) and CL = 2.2µF (for legacy chip),

FEEDBACK tied to VTAP, OUTPUT tied to SENSE, VSHUTDOWN ≤ 0.7V

PARAMETER

TEST CONDITIONS

TJ

MIN

TYP

MAX UNIT

Output low voltage

VIN ≥ 2V

IOL = 400µA

Legacy chip

25°C

150

250

mV

–40°C to

125°C

400

New chip

25°C

180

250

–40°C to

125°C

350

Upper threshold voltage (ERROR

output high)(4)

Legacy chip

25°C

40

60

mV

–40°C to

125°C

25

New chip

25°C

40

60

–40°C to

125°C

25

Lower threshold voltage (ERROR

output low)(4)

Legacy chip

25°C

75

95

mV

–40°C to

125°C

140

New chip

25°C

75

95

–40°C to

125°C

140

Hysteresis(4)

Legacy chip

25°C

15

mV

New chip

15

SHUTDOWN INPUT

Input logic voltage

Low (regulator ON)

Legacy chip

–40°C to

125°C

0.7

V

New chip

0.7

High (regulator OFF)

Legacy chip

–40°C to

125°C

2

New chip

2

SHUTDOWN input current

SHUTDOWN = 2.4V

Legacy chip

25°C

30

50

µA

–40°C to

125°C

100

New chip

25°C

0.2

0.5

–40°C to

125°C

1

SHUTDOWN = 30V

Legacy chip

25°C

450

600

–40°C to

125°C

750

New chip

25°C

0.3

0.5

–40°C to

125°C

1

Regulator output current

in shutdown

VSHUTDOWN ≥ 2V,

VIN ≥ 30V, VOUT = 0,

FEEDBACK tied to VTAP

Legacy chip

25°C

3

10

µA

–40°C to

125°C

20

New chip

25°C

4

6

–40°C to

125°C

7.5

(1)

Output or reference voltage temperature coefficient is defined as the worst-case voltage change divided by the total temperature

range.

(2)

Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to

heating effects are covered under the specification for thermal regulation.

LP2951-Q1

SLVSAW6H – JUNE 2011 – REVISED NOVEMBER 2024

www.ti.com

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