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AK4342EN Datasheet(PDF) 40 Page - Asahi Kasei Microsystems |
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AK4342EN Datasheet(HTML) 40 Page - Asahi Kasei Microsystems |
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40 / 43 page ![]() ASAHI KASEI [AK4342] MS0506-E-02 2006/07 - 40 - PACKAGE 32pin QFN (Unit: mm) 5.00 ± 0.10 4.75 ± 0.10 0.50 0.23 24 17 25 1 16 1 32 25 0.08 32 8 9 0.40 ± 0.10 24 +0.07 -0.05 C Exposed Pad 3.5 C0 .4 2 B A C M 0.10 AB Note) The exposed pad on the bottom surface of the package must be connected to the ground. Package & Lead frame material Package molding compound: Epoxy Lead frame material: Cu Lead frame surface treatment: Solder (Pb free) plate |
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