Bosch Sensortec | BME680 Datasheet

5 | 53

Modifications reserved |Data subject not change without notice | Printed in Germany

Document number: BST-BME680-DS001-09 Revision_1.9_022024

5. Global memory map and register description

27

5.1 General remarks .................................................................................................................................................27

5.2 Memory map .......................................................................................................................................................28

5.3 Register description ............................................................................................................................................29

5.3.1 General control registers..................................................................................................................................29

5.3.2 Temperature, pressure and relative humidity control registers ........................................................................30

5.3.3 Gas control registers ........................................................................................................................................32

5.3.4 Data registers ...................................................................................................................................................35

5.3.5 Status registers ................................................................................................................................................36

6. Digital interfaces

38

6.1 Interface selection ...............................................................................................................................................38

6.2 I²C Interface.........................................................................................................................................................38

6.2.1 I²C write ............................................................................................................................................................39

6.2.2 I²C read ............................................................................................................................................................39

6.3 SPI interface........................................................................................................................................................40

6.3.1 SPI write ...........................................................................................................................................................40

6.3.2 SPI read ...........................................................................................................................................................41

6.4 Interface parameter specification ........................................................................................................................41

6.4.1 General interface parameters ..........................................................................................................................41

6.4.2 I²C timings ........................................................................................................................................................42

6.4.3 SPI timings .......................................................................................................................................................43

7. Pin-out and connection diagram

44

7.1 Pin-out .................................................................................................................................................................44

7.2 Connection diagrams ..........................................................................................................................................45

7.3 Package dimensions ...........................................................................................................................................46

7.4 Landing pattern recommendation .......................................................................................................................47

7.5 Marking................................................................................................................................................................48

7.5.1 Mass production devices..................................................................................................................................48