3.2

March 26, 2021

ES9016K2M Datasheet

ESS TECHNOLOGY, INC. 109 Bonaventura Drive, San Jose, CA 95134, USA Tel (408) 643-

8800 • www.esstech.com

36

Table RPC-1 Classification reflow profile

Profile Feature

Pb-Free Assembly

Preheat/Soak

Temperature Min (Tsmin)

Temperature Max (Tsmax)

Time (ts) from (Tsmin to Tsmax)

150°C

200°C

60-120 seconds

Ramp-up rate (TL to Tp)

3°C / second max.

Liquidous temperature (TL)

Time (tL) maintained above TL

217°C

60-150 seconds

Peak package body temperature

(Tp)

For users Tp must not exceed the classification temp in Table RPC-2.

For suppliers Tp must equal or exceed the Classification temp in Table RPC-2.

Time (tp)* within 5°C of the

specified classification temperature

(Tc), see Figure RPC-1

30* seconds

Ramp-down rate (Tp to TL)

6°C / second max.

Time 25°C to peak temperature

8 minutes max.

* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.

Note 1: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow (e.g., live-bug).

If parts are reflowed in other than the normal live-bug assembly reflow orientation (i.e., dead-bug), Tp shall be within ± 2°C of the live-bug Tp and still

meet the Tc requirements, otherwise, the profile shall be adjusted to achieve the latter. To accurately measure actual peak package body

temperatures refer to JEP140 for recommended thermocouple use.

Note 2: Reflow profiles in this document are for classification/preconditioning and are not meant to specify board assembly profiles. Actual board assembly

profiles should be developed based on specific process needs and board designs and should not exceed the parameters in Table RPC-1.

For example, if Tc is 260°C and time tp is 30 seconds, this means the following for the supplier and the user.

For a supplier: The peak temperature must be at least 260°C. The time above 255°C must be at least 30 seconds.

For a user: The peak temperature must not exceed 260°C. The time above 255°C must not exceed 30 seconds.

Note 3: All components in the test load shall meet the classification profile requirements.

Table RPC-2 Pb-Free Process

– Classification Temperatures (Tc)

Package Thickness

Volume mm3, <350

Volume mm3, 350 to 2000

Volume mm3, >2000

<1.6 mm

260°C

260°C

260°C

1.6 mm

– 2.5 mm

260°C

250°C

245°C

>2.5 mm

250°C

245°C

245°C

Note 1: At the discretion of the device manufacturer, but not the board assembler/user, the maximum peak package body temperature (Tp) can exceed the

values specified in Table RPC-2. The use of a higher Tp does not change the classification temperature (Tc).

Note 2: Package volume excludes external terminals (e.g., balls, bumps, lands, leads) and/or non-integral heat sinks.

Note 3: The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processes

reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD packages may still exist.