www.ti.com

EXAMPLE BOARD LAYOUT

(5.8)

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

14X (1.5)

14X (0.45)

12X (0.65)

(3.4)

NOTE 9

(5)

NOTE 9

(3.155)

(3.255)

(

0.2) TYP

VIA

(1.1) TYP

(1.1)

TYP

(R0.05) TYP

4214867/A 09/2016

PowerPAD

TSSOP - 1.2 mm max height

PWP0014A

PLASTIC SMALL OUTLINE

SYMM

SYMM

SEE DETAILS

LAND PATTERN EXAMPLE

SCALE:10X

1

7

8

14

METAL COVERED

BY SOLDER MASK

SOLDER MASK

DEFINED PAD

15

TM

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).

9. Size of metal pad may vary due to creepage requirement.

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

SOLDER MASK DETAILS

PADS 1-14

SOLDER MASK

DEFINED

SOLDER MASK

METAL UNDER

SOLDER MASK

OPENING