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S29GL032A Datasheet(PDF) 19 Page - SPANSION |
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S29GL032A Datasheet(HTML) 19 Page - SPANSION |
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19 / 95 page  September 10, 2007 S29GL-A_00_A11 S29GL-A 19 Data She e t 6. Ordering Information 6.1 S29GL016A Standard Products Standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed by a combination of the following: Notes 1. Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can be packed in Types 0, 2, or 3. 2. TSOP package marking omits packing type designator from ordering part number. 3. BGA package marking omits leading S29 and packing type designator from ordering part number. Valid Combinations Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to confirm availability of specific valid combinations and to check on newly released combinations. S29GL016A 10 T A I R1 0 Packing Type 0= Tray 2 = 7-inch Tape and Reel 3 = 13-inch Tape and Reel Model Number R1 = x8/x16, VCC=3.0 – 3.6 V, Top boot sector device, top two address sectors protected when WP#/ACC=VIL R2 = x8/x16, VCC=3.0 – 3.6 V, Bottom boot sector device, bottom two address sectors protected when WP#/ACC=VIL 01 = x8/x16, Vcc = 2.7 - 3.6 V, Top boot sector device, top two address sectors protected when WP#/ACC = VIL 02 = x8/x16, Vcc = 2.7 - 3.6 V, Bottom boot sector device, bottom two address sectors protected when WP#/ACC = VIL W1= x16, VCC=2.7 – 3.6 V, 56-ball FBGA, top boot sector device* W2= x16, VCC=2.7 – 3.6 V, 56-ball FBGA, bottom boot sector device* *W1 and W2 are MCP-compatible packages for cellular handsets only Temperature Range I = Industrial (–40°C to +85°C) Package Material Set A = Standard F = Pb-Free Package Type T = Thin Small Outline Package (TSOP) Standard Pinout B = Fine-pitch Ball-Grid Array Package F = Fortified Ball-Grid Array Package Speed Option See Product Selector Guide on page 9 and Valid Combinations below Device Number/Description S29GL016A 3.0 Volt-only, 16 Megabit Page-Mode Flash Memory Manufactured on 200 nm MirrorBit ® Process Technology. Table 6.1 S29GL016A Ordering Options S29GL016A Valid Combinations Package Description (Notes) Device Number Speed Option Package, Material, & Temperature Range Model Number Packing Type (Note 1) S29GL016A 90, 10 TAI, TFI R1, R2 0, 3 TS048 (Note 2) TSOP BAI, BFI 0, 2, 3 VBK048 (Note 3) Fine-Pitch BGA FAI, FFI LAA064 (Note 3) Fortified BGA 10 BAI, BFI W1, W2 VBU056 (Note 3) Fine-Pitch BGA (For cellular handsets only) 10 TAI, TFI 01, 02 0, 3 TS048 (Note 2) TSOP BAI, BFI 0, 2, 3 VBK048 (Note 3) Fine-Pitch BGA FAI, FFI LAA064 (Note 3) Fortified BGA |
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