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S29GL032A Datasheet(PDF) 20 Page - SPANSION |
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S29GL032A Datasheet(HTML) 20 Page - SPANSION |
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20 / 95 page ![]() 20 S29GL-A S29GL-A_00_A11 September 10, 2007 Da ta Sh e e t 6.2 S29GL032A Standard Products Standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed by a combination of the following: Notes 1. Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can be packed in Types 0, 2, or 3. 2. TSOP package marking omits packing type designator from ordering part number. 3. BGA package marking omits leading S29 and packing type designator from ordering part number. Valid Combinations Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to confirm availability of specific valid combinations and to check on newly released combinations. S29GL032A 90 T A I R1 0 Packing Type 0= Tray 2 = 7-inch Tape and Reel 3 = 13-inch Tape and Reel Model Number R1 = x8/x16, VCC=3.0 – 3.6 V, Uniform sector device, highest address sector protected when WP#/ACC=VIL R2 = x8/x16, VCC=3.0 – 3.6 V, Uniform sector device, lowest address sector protected when WP#/ACC=VIL R3 = x8/x16, VCC=3.0 – 3.6 V, Top boot sector device, top two address sectors protected when WP#/ACC=VIL R4 = x8/x16, VCC=3.0 – 3.6 V, Bottom boot sector device, bottom two address sectors protected when WP#/ACC=VIL W3= x16, VCC=2.7 – 3.6 V, 56-ball FBGA, top boot sector device * W4= x16, VCC=2.7 – 3.6 V, 56-ball FBGA, bottom boot sector device* *W3 and W4 are MCP-compatible packages for cellular handsets only Temperature Range I = Industrial (–40°C to +85°C) Package Material Set A = Standard F = Pb-Free Package Type T = Thin Small Outline Package (TSOP) Standard Pinout B = Fine-pitch Ball-Grid Array Package F = Fortified Ball-Grid Array Package Speed Option See Product Selector Guide on page 9 and Valid Combinations below Device Number/Description S29GL032A 32 Megabit Page-Mode Flash Memory Manufactured using 200 nm MirrorBit® Process Technology, 3.0 Volt-only Read, Program, and Erase Table 6.2 S29GL032A Ordering Options S29GL032A Valid Combinations Package Description (Notes) Device Number Speed Option Package, Material, & Temperature Range Model Number Packin g Type S29GL032A 90, 10, 11 TAI,TFI R1, R2 0,2,3 (Note 1) TS056 (Note 2) TSOP FAI,FFI LAA064 (Note 3) Fortified BGA TAI,TFI R3,R4 TS048 (Note 2) TSOP BAI,BFI VBK048 (Note 3) Fine-Pitch BGA FAI,FFI LAA064 (Note 3) Fortified BGA 10, 11 BAI,BFI W3,W4 VBU056 (Note 3) Fine-Pitch BGA (For cellular handsets only) |
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