LP5951

SNVS345G – JUNE 2006 – REVISED DECEMBER 2014

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted)

(1)

MIN

MAX

UNIT

IN pin: Voltage to GND

–0.3

6.5

V

EN pin: Voltage to GND

–0.3 to (VIN + 0.3 V)

(2)

6.5

Continuous power dissipation(3)

Internally limited

Junction temperature (TJ-MAX )

150

Package peak reflow temperature (10-20 s)

240

°C

Package peak reflow temperature (Pb-free, 10-20 s)

260

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The lower of VIN + 0.3 or 6.5 V.

(3)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 160°C (typ.) and

disengages at TJ = 140°C (typ.).

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

NOM

MAX

UNIT

VIN

Input voltage

1.8

5.5

V

VEN

Enable input voltage

0

(VIN + 0.3)

V

TJ

Junction temperature

–40

125

°C

TA

Ambient temperature

See Power Dissipation And Device Operation

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

6.4 Thermal Information

LP5951

THERMAL METRIC(1)

SOT-23 (DBV)

SC70 (DCK)

UNIT

5 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

195.6

276.7

RθJC(top)

Junction-to-case (top) thermal resistance

108.3

86.3

RθJB

Junction-to-board thermal resistance

52.1

56.9

°C/W

ψJT

Junction-to-top characterization parameter

11.0

1.3

ψJB

Junction-to-board characterization parameter

51.6

56.1

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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