TPS22932B

SLVS802C – AUGUST 2009 – REVISED MAY 2015

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7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

IOUT

Output current

500

mA

VIN

Input voltage

1.1

3.6

V

VOUT

Output voltage

VIN

CIN

Input capacitor

1(1)

μF

TA

Operating free-air temperature

–40

85

°C

(1)

See Application Information.

7.4 Thermal Information

TPS22932B

THERMAL METRIC(1)

YFP (DSBGA)

UNIT

6 PINS

RθJA

Junction-to-ambient thermal resistance

125.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

1.4

°C/W

RθJB

Junction-to-board thermal resistance

26

°C/W

ψJT

Junction-to-top characterization parameter

0.6

°C/W

ψJB

Junction-to-board characterization parameter

26

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.5 Electrical Characteristics

VIN = 1.1 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)

PARAMETER

TEST CONDITIONS

TA

MIN TYP(1)

MAX

UNIT

VIN = 1.1 V

140

275

IIN

Quiescent current

IOUT = 0

VIN = 1.8 V

Full

280

500

nA

VIN = 3.6 V

860

920

VIN = 1.1 V

80

225

IIN(OFF)

OFF-state supply current

VON = GND, OUT = Open

VIN = 1.8 V

Full

125

300

nA

VIN = 3.6 V

340

650

VIN = 1.1 V

80

225

IIN(LEAKAGE)

OFF-state switch current

VON = GND, VOUT = 0

VIN = 1.8 V

Full

125

300

nA

VIN = 3.6 V

340

650

25°C

55

70

VIN = 3.6 V

Full

85

25°C

65

80

VIN = 2.5 V

Full

100

25°C

75

90

rON

ON-state resistance

IOUT = –200 mA

VIN = 1.8 V

m

Ω

Full

110

25°C

115

130

VIN = 1.2 V

Full

155

25°C

135

150

VIN = 1.1 V

Full

170

rPD

Output pulldown resistance

VIN = 3.3 V, VON = 0, IOUT = 30 mA

25°C

75

120

Ω

ON-state input leakage

ION

VON = 1.1 V to 3.6 V or GND

Full

1

μA

current

Control Inputs (ON1, ON2, ON3)

(1)

Typical values are at the specified VIN and TA = 25°C.

4

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