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LM3697

SNOSCS2D – NOVEMBER 2013 – REVISED MARCH 2019

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Copyright © 2013–2019, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 4

6

Specifications......................................................... 5

6.1

Absolute Maximum Ratings ...................................... 5

6.2

ESD Ratings.............................................................. 5

6.3

Recommended Operating Conditions ....................... 5

6.4

Thermal Information .................................................. 5

6.5

Electrical Characteristics .......................................... 6

6.6

Timing Requirements ................................................ 7

6.7

Typical Characteristics .............................................. 8

7

Detailed Description .............................................. 9

7.1

Overview ................................................................... 9

7.2

Functional Block Diagram ......................................... 9

7.3

Feature Descriptions ............................................... 10

7.4

Device Functional Modes........................................ 13

7.5

Register Maps ......................................................... 17

8

Application and Implementation ........................ 21

8.1

Application Information............................................ 21

8.2

Typical Applications ................................................ 21

8.3

Initialization Set Up ................................................. 32

9

Power Supply Recommendations ...................... 32

10

Layout................................................................... 33

10.1

Layout Guidelines ................................................. 33

10.2

Layout Example .................................................... 36

11

Device and Documentation Support ................. 37

11.1

Device Support...................................................... 37

11.2

Related Documentation ....................................... 37

11.3

Receiving Notification of Documentation Updates 37

11.4

Community Resources.......................................... 37

11.5

Trademarks ........................................................... 37

11.6

Electrostatic Discharge Caution ............................ 37

11.7

Glossary ................................................................ 37

12

Mechanical, Packaging, and Orderable

Information ........................................................... 37

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (October 2015) to Revision D

Page

•

Changed Table 2 revision register POWER-ON RESET value from 0x00 to 0x01, change silicon revision value in

Table 3 from 0000 to 0001 .................................................................................................................................................. 17

Changes from Revision B (April 2014) to Revision C

Page

•

Changed format of Device Information; add footnote and "MAX" ......................................................................................... 1

•

Changed Handling Ratings table to ESD Ratings table format; move storage temp to Abs Max table................................. 5

•

Added additional Thermal Information ................................................................................................................................... 5

•

Added subsection High-Speed Mode .................................................................................................................................. 16

Changes from Revision A (December 2013) to Revision B

Page

•

Changed to new TI datasheet standards; added Handling Ratings table; added 2 ambient temperature specs to

IHVLED and one to IMATCH_HV ..................................................................................................................................................... 1

•

Changed title from Pin Configurations to Terminal Functions and all references from "pins" to "terminals" ......................... 4

•

Changed change "terminal" back to "pin" per latest documentation standard; add "Type" column to Pin Functions

table ....................................................................................................................................................................................... 4

•

Changed Timing information from Elec Char table Timing Requirements ............................................................................. 7

•

Changed Functional Description section to Detailed Description section ............................................................................. 9

•

Changed Applications Information section to Application and Implementation ................................................................... 22

•

Changed Typical Characteristics from own section into subsection of Specifications ........................................................ 24

•

Added new Power Supply Recommendations section ........................................................................................................ 32

•

Changed Layout section to include separate Layout Example ........................................................................................... 33

•

Added new Device and Documentation Support section and Mechanical, Packaging and Orderable paragraph ............. 37