AM486DE2 datasheet(49/52 Pages) AMD

49 / 52 page

Am486DE2 Microprocessor

*0.350

″ high unidirectional heat sink (Al alloy 6063-T5, 40 mil fin width, 155 mil center-to-center fin spacing).

Table 15. Thermal Resistance (°C/W)

JC and θJA for the Am486DE2 in 168-Pin PGA Package

Cooling

Mechanism

JA vs. Airflow-ft/min. (m/sec)

0 (0)

200

(1.01)

400

(2.03)

600

(3.04)

800

(4.06)

1000

(5.07)

No Heat Sink

1.5

16.5

14.0

12.0

10.5

9.5

9.0

Heat Sink*

2.0

12.0

7.0

5.0

4.0

3.5

3.25

Heat Sink* and fan

2.0

5.0

4.6

4.2

3.8

3.5

3.25

Table 16. Maximum TA at Various Airflows in °C

A by Cooling

Type

Clock

Airflow-ft/min. (m/sec)

0 (0)

200

(1.01)

400

(2.03)

600

(3.04)

800

(4.06)

1000

(5.07)

TA without Heat Sink

66 MHz

49.0

55.0

59.8

63.4

65.8

67.0

TA with Heat Sink

66 MHz

61.0

73.0

77.8

80.2

81.4

82.0

TAwith Heat Sink and

fan

66 MHz

77.8

78.8

79.7

80.7

81.4

82.0

Figure 26. . Heat Sink Dimensions

0.290

″

0.100

″

0.040

″

1.53

″

0.350

″

0.060

″

0.115

″

17852B-113

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