6.4 Thermal Information

THERMAL METRIC(1) (2)

TL77xxB

UNIT

D (SOIC)

P (PDIP)

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

109.2

51.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

56

40.6

°C/W

RθJB

Junction-to-board thermal resistance

49.9

28.6

°C/W

ψJT

Junction-to-top characterization parameter

11.4

17.7

°C/W

ψJB

Junction-to-board characterization parameter

49.4

28.5

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

Maximum power dissipation is a function of TJ(max), RθJA , and TA. The maximum allowable power dissipation at any allowable ambient

temperature is PD = (TJ(max) – TA) / RθJA. Operating at the absolute maximum TJ of 150°C can affect reliability.

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TL7702B, TL7705B, TL7733B

SLVS037O – SEPTEMBER 1989 – REVISED DECEMBER 2020

Copyright © 2020 Texas Instruments Incorporated

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