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CD4069UB

SCHS054E – NOVEMBER 1998 – REVISED JANUARY 2019

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Copyright © 1998–2019, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

During soldering at distance 1/16 inch ± 1/32 inch (1.59 mm ± 0.79 mm) from case for 10 s maximum

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VDD

DC supply-voltage (voltages referenced to VSS terminal)

–0.5

20

V

VI

Input voltage, all inputs

–0.5

VDD + 0.5

V

IIK

DC input current, any one input

–10

10

mA

PD

Power dissipation per package

–55°C to 100°C

500

mW

100°C to 125°C

12

200

Device dissipation per output transistor

Full range (all package types)

100

mW

Lead temperature(2)

265

°C

TJ

Junction temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±500

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±200

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VDD

Supply voltage

3

18

V

TA

Operating temperature

–55

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

THERMAL METRIC(1)

CD4069UB

UNIT

D (SOIC)

J (CDIP)

N (PDIP)

NS (SO)

PW (TSSOP)

14 PINS

14 PINS

14 PINS

14 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance

94.9

—

57.9

91.2

122.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

56.4

28.5

45.5

48.8

50.8

°C/W

RθJB

Junction-to-board thermal resistance

49.2

—

37.7

50

63.8

°C/W

ψJT

Junction-to-top characterization parameter

21.1

—

30.6

15

6.3

°C/W

ψJB

Junction-to-board characterization parameter

48.9

—

37.6

49.6

63.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

N/A

N/A

°C/W