6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) (2)

MIN

MAX

UNIT

Voltage

VCC1, VCC2

–0.5

6

V

SDA1, SCL1

–0.5

VCC1 + 0.5(3)

SDA2, SCL2

–0.5

VCC2 + 0.5(3)

IO

Output current

SDA1, SCL1

0

20

mA

SDA2, SCL2

0

100

TJ(MAX)

Maximum junction temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

All voltage values here within are with respect to the local ground pin (GND1 or GND2) and are peak voltage values.

(3)

Maximum voltage must not exceed 6 V.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC

JS-001(1)

Bus pins

±8000

V

All pins

±4000

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

VCC1, VCC2

Supply voltage

3

5.5

V

VSDA1, VSCL1

Input and output signal voltages, side 1

0

VCC1

V

VSDA2, VSCL2

Input and output signal voltages, side 2

0

VCC2

V

VIL1

Low-level input voltage, side 1

0

0.5

V

VIH1

High-level input voltage, side 1

0.7 × VCC1

VCC1

V

VIL2

Low-level input voltage, side 2

0

0.3 × VCC2

V

VIH2

High-level input voltage, side 2

0.7 × VCC2

VCC2

V

IOL1

Output current, side 1

0.5

3.5

mA

IOL2

Output current, side 2

0.5

35

mA

C1

Capacitive load, side 1

40

pF

C2

Capacitive load, side 2

400

pF

fMAX

Operating frequency(1)

1

MHz

TA

Ambient temperature

–40

125

°C

TJ

Junction temperature

–40

136

°C

TSD

Thermal shutdown

139

197

°C

(1)

This represents the maximum frequency with the maximum bus load (C) and the maximum current sink (IO). If the system has less bus

capacitance, then higher frequencies can be achieved.

ISO1540, ISO1541

SLLSEB6F – JULY 2012 – REVISED DECEMBER 2022

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