2

1

1

2

3

0.5"

Figure 8-10. Printed-Circuit Board Used to Generate Thermal Response Curves (New Test Setup for Both

New Chip and Legacy Chip)

8.5.3 Thermal Considerations

Table 8-2 summarizes the thermal resistance of the LM50 for different conditions.

Table 8-2. Temperature Rise of LM50 Due to Self-Heating

RθJA (°C/W)

SOT-23

No heat sink(1)

Still air

(Legacy chip)

291.9

Moving air

(Legacy chip)

-

Small heat fin(2)

Still air

(Legacy chip)

260

Moving air

(Legacy chip)

180

(1)

Part soldered to 30 gauge wire.

(2)

Heat sink used is 0.5inch, square printed-circuit board with 2oz foil; part attached as shown in Figure 8-9.

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LM50

SNIS118H – JULY 1999 – REVISED MAY 2025

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