Table 4-2. LM50/LM50-Q1 Device Orderable Options

ORDER NUMBER

PACKAGE

ACCURACY OVER

TEMPERATURE

SPECIFIED TEMPERATURE RANGE

LM50BIM3

SOT-23

(DBZ)

3-pin

±3°C

–25°C ≤ TA ≤ +100°C

LM50BIM3X/NOPB (1)

–25°C ≤ TA ≤ +100°C

(Legacy chip)

–40°C ≤ TA ≤ +125°C

(New chip)

LM50CIM3

±4°C

–40°C ≤ TA ≤ +125°C

LM50CIM3X

LM50CIM3X/NOPB

–40°C ≤ TA ≤ +125°C

(Both legacy & new chip)

LM50QIM3X/NOPB

±4°C

–40°C ≤ TA ≤ +125°C

(Both legacy & new chip)

1. LM50BIM3X/NOPB (Legacy chip) operates from –25°C to 100°C while LM50BIM3X/NOPB (New chip)

operates from –40°C to 125°C.

Table 4-3. LM50/LM50-Q1 Device Nomenclature Detail

PRODUCT

DESCRIPTION

LM50xIyyy

x indicates that the device has B, C or Q (grade-1 device in accordance with the AEC-Q100

standard) variant. These devices can ship with the legacy chip (CSO: GF6 or SHE) or the new chip

(CSO: RFB) with different chip source origin (CSO). The reel packaging label provides date code

information to distinguish which chip is being used. Device performance for new and legacy chips is

denoted throughout the document.

yyy indicates that the package type of the device which can be M3, M3X and M3X/NOPB all in

SOT-23 3-pin package.

5 Pin Configuration and Functions

1

+V

S

V

O

GND

2

3

Figure 5-1. DBZ Package 3-Pin SOT-23 Top View

Table 5-1. Pin Functions

PIN

TYPE

DESCRIPTION

NO.

NAME

1

+VS

Power

Positive power supply pin.

2

VO

Output

Temperature sensor analog output.

3

GND

Ground

Device ground pin, connected to power supply negative terminal.

LM50

SNIS118H – JULY 1999 – REVISED MAY 2025

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