6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range unless otherwise noted(1)

MIN

MAX

UNIT

Supply voltage, +VS

LM50

-0.2

12

V

Output voltage, VO

-1

+VS + 0.6

V

Output current, IOUT

10

mA

Maximum junction temperature, TJ

150

°C

Storage temperature, Tstg

-65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

VALUE

UNIT

V(ESD) , Electrostatic discharge LM50

Human-body model (HBM), per JESD22-A114(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101

±750

(1)

The human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin. The machine model is a 200pF

capacitor discharged directly into each pin.

6.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

+VS

Supply voltage

LM50

4.5

10

V

TMIN,TMAX

Specified temperature

LM50B

Legacy chip

-25

100

°C

New chip

-40

125

LM50C

-40

125

6.4 Thermal Information

THERMAL METRIC(1)

LM50

UNIT

DBZ (SOT-23)

3 PINS

LEGACY CHIP

NEW CHIP

RθJA

Junction-to-ambient thermal resistance

291.9

240.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

114.3

144.5

°C/W

RθJB

Junction-to-board thermal resistance

62.3

72.3

°C/W

ψJT

Junction-to-top characterization parameter

7.4

28.7

°C/W

ψJB

Junction-to-board characterization parameter

61

71.7

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

-

-

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

www.ti.com

LM50

SNIS118H – JULY 1999 – REVISED MAY 2025

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