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CC3301MOD Datasheet(PDF) 27 Page - Texas Instruments

Part # CC3301MOD
Description  CC330xMOD SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy Companion Module
PDF  35 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

CC3301MOD Datasheet(HTML) 27 Page - Texas Instruments

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9 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop systems are listed below.
9.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
9.2 Device Nomenclature Boilerplate
Device development evolutionary flow:
X
Experimental device that is not necessarily representative of the final device's electrical specifications and
may not use production assembly flow.
P
Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical
specifications.
null Production version of the silicon die that is fully qualified.
Support tool development evolutionary flow:
TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.
TMDS Fully-qualified development-support product.
X and P devices and TMDX development-support tools are shipped against the following disclaimer:
Device development evolutionary flow:
TMX Experimental device that is not necessarily representative of the final device's electrical specifications and
may not use production assembly flow.
TMP Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical
specifications.
TMS Production version of the silicon die that is fully qualified.
Support tool development evolutionary flow:
TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.
TMDS Fully-qualified development-support product.
TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
Production devices and TMDS development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (X or P) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system because their
expected end-use failure rate still is undefined. Only qualified production devices are to be used.
9.3 Tools and Software
Design Kits and Evaluation Modules
CC3301MOD
BoosterPack plug-in
module
The CC3301MOD BoosterPack™ plug-in module (BP-CC3301MOD) is a test and
development board that can be easily connected to TI LaunchPad™ development
kits or processor boards; thus enabling rapid software development.
www.ti.com
CC3300MOD, CC3301MOD
SWRS333A – JULY 2025 – REVISED AUGUST 2025
Copyright © 2025 Texas Instruments Incorporated
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Product Folder Links: CC3300MOD CC3301MOD



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