4

DAC53608, DAC43608

SLASEQ4A – OCTOBER 2018 – REVISED DECEMBER 2018

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Copyright © 2018, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input voltage

VDD to AGND

–0.3

6

V

VREFIN to AGND

–0.3

VDD + 0.3

Digital input(s) to AGND

–0.3

VDD + 0.3

Output voltage

VOUT to AGND

–0.3

VDD + 0.3

V

Input Current

Current into any pin

–10

10

mA

Temperature

Junction temperature,TJ

–40

150

°C

Storage temperature, Tstg

–65

150

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. [Following sentence

optional; see the wiki.] Manufacturing with less than 500-V HBM is possible with the necessary precautions. [Following sentence

optional; see the wiki.] Pins listed as ±WWW V and/or ±XXX V may actually have higher performance.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. [Following sentence

optional; see the wiki.] Manufacturing with less than 250-V CDM is possible with the necessary precautions. [Following sentence

optional; see the wiki.] Pins listed as ±YYY V and/or ±ZZZ V may actually have higher performance.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per

ANSI/ESDA/JEDEC JS-001, allpins(1)

±1000

V

Charged device model (CDM), per JEDEC

specificationJESD22-C101, all pins(2)

±500

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD to AGND

Positive supply voltage to ground

1.8

5.5

V

VREFIN to AGND

Reference input supply voltage to ground

1.8

VDD

V

VIH

Digital input high voltage, 1.8

≤ VDD ≤ 2.7

VDD – 0.3

V

VIH

Digital input high voltage, 2.7 < VDD ≤ 5.5

2.4

V

VIL

Digital input low voltage

0.5

V

TA

Ambient temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

THERMAL METRIC(1)

DACx3608

UNIT

RTE (WQFN)

16 PIN

RθJA

Junction-to-ambient thermal resistance

49

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

50

°C/W

RθJB

Junction-to-board thermal resistance

24.1

°C/W

ΨJT

Junction-to-top characterization parameter

1.1

°C/W

YJB

Junction-to-board characterization parameter

24.1

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

8.7

°C/W