10 Device and Documentation Support

10.1 Device Support

10.1.1 Development Support

• LIDAR Pulsed Time of Flight Reference Design

• LIDAR-Pulsed Time-of-Flight Reference Design Using High-Speed Data Converters

• Wide Bandwidth Optical Front-end Reference Design

10.2 Documentation Support

10.2.1 Related Documentation

For related documentation, see the following:

• Texas Instruments, OPA855EVM user's guide

• Texas Instruments, Training Video: High-Speed Transimpedance Amplifier Design Flow

• Texas Instruments, Training Video: How to Design Transimpedance Amplifier Circuits

• Texas Instruments, Training Video: How to Convert a TINA-TI Model into a Generic SPICE Model

• Texas Instruments, Transimpedance Considerations for High-Speed Amplifiers application report

• Texas Instruments, What You Need To Know About Transimpedance Amplifiers – Part 1

• Texas Instruments, What You Need To Know About Transimpedance Amplifiers – Part 2

10.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

10.4 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

10.5 Trademarks

TI E2E™ is a trademark of Texas Instruments.

Excel® is a registered trademark of Microsoft Corporation.

All trademarks are the property of their respective owners.

10.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

10.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

11 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (January 2023) to Revision D (May 2025)

Page

• Changed bare die status from preview to production data (active).................................................................... 1

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OPA855

SBOS622D – JULY 2018 – REVISED MAY 2025

Copyright © 2025 Texas Instruments Incorporated

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Product Folder Links: OPA855