THS4541IRUNR.B datasheet(4/66 Pages) TI2

4 / 66 page

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Voltage

Supply voltage, (Vs+) – Vs–

5.5

Input/output voltage range

(Vs–) – 0.5

(Vs+) + 0.5

Differential input voltage

±1

Current

Continuous input current

±20

Continuous output current

±80

Continuous power dissipation

See Section 6.4 and Section 7.8

Junction

150

°C

Operating free-air

–40

125

Tstg

Storage

–65

150

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2)

±500

Machine model(2)

±150

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Vs+

Single-supply voltage

2.7

5.4

Junction temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

THS4541

UNIT

RGT (VQFN)

RUN (WQFN)

16 PINS

10 PINS

RθJA

Junction-to-ambient thermal resistance

146

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

°C/W

RθJB

Junction-to-board thermal resistance

°C/W

ψJT

Junction-to-top characterization parameter

2.7

°C/W

ψJB

Junction-to-board characterization parameter

105

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

9.3

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

report.

THS4541

SLOS375B – AUGUST 2014 – REVISED FEBRUARY 2024

www.ti.com

Submit Document Feedback

Product Folder Links: THS4541

THS4541IRUNR.B Datasheet(PDF) 4 Page - Texas Instruments

THS4541IRUNR.B Datasheet(HTML) 4 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66

Datasheet Download

Link URL