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THS4541IRUNR.B Datasheet(PDF) 59 Page - Texas Instruments |
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THS4541IRUNR.B Datasheet(HTML) 59 Page - Texas Instruments |
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59 / 66 page ![]() www.ti.com PACKAGE OUTLINE C 16X 0.30 0.18 1.45 0.1 16X 0.5 0.3 1 MAX (0.2) TYP 0.05 0.00 12X 0.5 4X 1.5 A 3.1 2.9 B 3.1 2.9 VQFN - 1 mm max height RGT0016A PLASTIC QUAD FLATPACK - NO LEAD 4219032/A 02/2017 PIN 1 INDEX AREA 0.08 SEATING PLANE 1 4 9 12 5 8 16 13 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 EXPOSED THERMAL PAD SYMM SYMM 17 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. 4. Reference JEDEC registration MO-220 SCALE 3.600 |
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