10 Device and Documentation Support

10.1 Documentation Support

10.1.1 Related Documentation

For related documentation, see the following:

• Texas Instruments, Sample and Hold Glitch Reduction for Precision Outputs Reference Design.

• Texas Instruments, True Differential, 4 x 2 MUX, Analog Front End, Simultaneous-Sampling ADC Circuit.

• Texas Instruments, Improve Stability Issues with Low CON Multiplexers.

• Texas Instruments, Simplifying Design with 1.8V logic Muxes and Switches.

• Texas Instruments, Eliminate Power Sequencing with Powered-off Protection Signal Switches.

• Texas Instruments, System-Level Protection for High-Voltage Analog Multiplexers.

• Texas Instruments, QFN/SON PCB Attachment.

• Texas Instruments, Quad Flatpack No-Lead Logic Packages.

10.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

10.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

10.4 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

10.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

10.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

11 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (August 2019) to Revision C (December 2023)

Page

• Updated the numbering format for tables, figures, and cross-references throughout the document................. 1

• Updated Is or Id (Continuous Current) values....................................................................................................4

• Added Ipeak values to recommended operating conditions table...................................................................... 4

Changes from Revision A (June 2019) to Revision B (August 2019)

Page

• Deleted the Product Preview note from: TMUX1113, TMUX1112 and the RSV package in the Device

Information table.................................................................................................................................................1

• Deleted the Product Preview note from: TMUX1113, TMUX1112 in the Device Comparison Table table..........2

• Deleted the Product Preview note from:the RSV package in the Pin Configuration and Functions section...... 3

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TMUX1111, TMUX1112, TMUX1113

SCDS408C – FEBRUARY 2019 – REVISED DECEMBER 2023

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Product Folder Links: TMUX1111 TMUX1112 TMUX1113