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TDA2SA Datasheet(PDF) 311 Page - Texas Instruments

Part # TDA2SA
Description  TDA2x ADAS Applications Processor 23mm Package (ABC Package) Silicon Revision 2.0
PDF  427 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

TDA2SA Datasheet(HTML) 311 Page - Texas Instruments

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mmc _clk
2
mmc _cmd
2
mmc _dat
2
[7:0]
HS2005
HS2005
HS2006
HS2006
HS2001
HS2002L
HS2002H
MMC2_05
311
TDA2SX, TDA2SG, TDA2SA
TDA2HG, TDA2HV, TDA2HF, TDA2LF
www.ti.com
SPRS951F – DECEMBER 2015 – REVISED MAY 2019
Submit Documentation Feedback
Product Folder Links: TDA2SX TDA2SG TDA2SA TDA2HG TDA2HV TDA2HF TDA2LF
Timing Requirements and Switching Characteristics
Copyright © 2015–2019, Texas Instruments Incorporated
(1) P = output mmc2_clk period in ns
Figure 7-72. eMMC in - HS200 SDR - Transmitter Mode
7.22.2.4 High-speed JC64 DDR, 8-bit data
Table 7-109 and Table 7-110 present Timing requirements and Switching characteristics for MMC2 - High
speed DDR in receiver and transmitter mode (see Figure 7-73 and Figure 7-74).
Table 7-109. Timing Requirements for MMC2 - JC64 High Speed DDR Mode
NO.
PARAMETER
DESCRIPTION
MODE
MIN
MAX
UNIT
DDR3
tsu(cmdV-clk)
Setup time, mmc2_cmd valid before mmc2_clk
transition
1.8
ns
DDR4
th(clk-cmdV)
Hold time, mmc2_cmd valid after mmc2_clk transition
1.8
ns
DDR7
tsu(dV-clk)
Setup time, mmc2_dat[7:0] valid before mmc2_clk
transition
1.8
ns
DDR8
th(clk-dV)
Hold time, mmc2_dat[7:0] valid after mmc2_clk
transition
Pad Loopback (1.8V)
1.8 (1)
ns
Pad Loopback (3.3V)
1.8
ns
Internal Loopback
1.8 (1)
ns
(1) This Hold time requirement is larger than the Hold time provided by a typical eMMC component. Therefore, the trace length between the
Device and eMMC component must be sufficiently long enough to ensure that the Hold time is met at the Device.
Table 7-110. Switching Characteristics for MMC2 - JC64 High Speed DDR Mode
NO.
PARAMETER
DESCRIPTION
MIN
MAX
UNIT
DDR1
fop(clk)
Operating frequency, mmc2_clk
48
MHz
DDR2H
tw(clkH)
Pulse duration, mmc2_clk high
0.5*P-
0.172 (1)
ns
DDR2L
tw(clkL)
Pulse duration, mmc2_clk low
0.5*P-
0.172 (1)
ns
DDR5
td(clk-cmdV)
Delay time, mmc2_clk transition to mmc2_cmd transition
2.9
7.14
ns
DDR6
td(clk-dV)
Delay time, mmc2_clk transition to mmc2_dat[7:0] transition
2.9
7.14
ns
(1) P = output mmc2_clk period in ns
Table 7-111 and Table 7-112 present Timing requirements and Switching characteristics for MMC2 - High
speed DDR in receiver and transmitter mode During Boot (see Figure 7-73 and Figure 7-74).
Table 7-111. Timing Requirements for MMC2 - JC64 High Speed DDR Mode During Boot
NO.
PARAMETER
DESCRIPTION
MODE
MIN
MAX
UNIT
DDR3
tsu(cmdV-clk)
Setup time, mmc2_cmd valid before mmc2_clk transition
Boot (1.8V)
1.8
ns
Boot (3.3V)
1.8
ns
DDR4
th(clk-cmdV)
Hold time, mmc2_cmd valid after mmc2_clk transition
Boot (1.8V)
1.8 (1)
ns
Boot (3.3V)
1.8 (1)
ns



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