TDA2SA datasheet(369/427 Pages) TI2

369 / 427 page

CMF

AC Cap

SoC TX

SoC RX

SPRS85x_PCB_USB30_2

Device

usb_txp0

usb_txn0

usb_rxp0

usb_rxn0

CMF

AC Caps

Place near connector, and keep routing short

Vias (if necessary)

SPRS85x_PCB_USB30_1

369

TDA2SX, TDA2SG, TDA2SA

TDA2HG, TDA2HV, TDA2HF, TDA2LF

www.ti.com

SPRS951F – DECEMBER 2015 – REVISED MAY 2019

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Product Folder Links: TDA2SX TDA2SG TDA2SA TDA2HG TDA2HV TDA2HF TDA2LF

Applications, Implementation, and Layout

Figure 8-39. USB 3.0 Interface High Level Schematic

NOTE

ESD components should be on a PCB layer next to a system GND plane layer so the

inductance of the via to GND will be minimal.

If vias are used, place the vias near the AC Caps or CMFs and under the SoC BGA, if

necessary.

Figure 8-40 present placement diagram for USB 3.0 interface.

Figure 8-40. USB 3.0 placement diagram

Table 8-12. USB1 Component Reference

INTERFACE

COMPONENT

SUPPLIER

PART NUMBER

USB3 PHY

ESD

TPD1E05U06

CMF

Murata

DLW21SN900HQ2

100nF (typical size: 0201)

TDA2SA Datasheet(PDF) 369 Page - Texas Instruments

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