TDA2SA datasheet(367/427 Pages) TI2

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367

TDA2SX, TDA2SG, TDA2SA

TDA2HG, TDA2HV, TDA2HF, TDA2LF

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SPRS951F – DECEMBER 2015 – REVISED MAY 2019

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Product Folder Links: TDA2SX TDA2SG TDA2SA TDA2HG TDA2HV TDA2HF TDA2LF

Applications, Implementation, and Layout

For the contact discharge test mode, the preferred way is direct contact applied to the conductive surfaces

of the equipment under test (EUT). In the case of the USB system, the conductive surface is the outer

casing of the USB connector. The electrode of the ESD generator is held in contact with the EUT or a

coupling plane prior to discharge. The arc formation is created under controlled conditions, inside a relay,

resulting in repeatable waveforms; however, this arc does not accurately recreate the characteristic unique

to the arc of an actual ESD event.

8.5.2.3.1.2 Air Discharge Mode

The air discharge usually applies to a non-conductive surface of the EUT. Instead of a direct contact with

the EUT, the charged electrode of the ESD generator is brought close to the EUT, and a spark in the air to

the EUT actuates the discharge. Compared to the contact discharge mode, the air discharge is more

realistic to the actual ESD occurrence. However, due to the variations of the arc length, it may not be able

to produce repeatable waveform.

8.5.2.3.1.3 Test Type

The IEC ESD Stressing test has two test types: direct discharge and indirect discharge. Direct discharge

is applies directly to the surface or the structure of the EUT. It includes both contact discharge and air

discharge modes. Indirect discharge applies to a coupling plane in the vicinity of the EUT. The indirect

discharge is used to simulate personal discharge to objects which are adjacent to the EUT. It includes

contact discharge mode only.

8.5.2.3.2 TI Component Level IEC ESD Test

TI Component Level IEC ESD Test tests only the IC terminals that are exposed in system level

applications. It can be used to determine the robustness of on-chip protection and the latch-up immunity.

The IC can only pass the TI Component Level IEC ESD test when there is no latch-up and IC is fully

functional after the test.

8.5.2.3.3 Construction of a Custom USB Connector

A standard USB connector, either type A or type B, provides good ESD protection. However, if a custom

USB connector is desired, the following guidelines should be observed to ensure good ESD protection.

•

There should be an easily accessible shield plate next to the connector for air-discharge mode

purpose.

•

Tie the outer shield of the connector to GND. When a cable is inserted into the connector, the shield of

the cable should first make contact with the outer shield.

•

If the connector includes power and GND, the lead of power and GND need to be longer than the

leads of signal.

•

The connector needs to have a key to ensure proper insertion of the cable.

•

See the standard USB connector for reference.

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