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TDA2SA Datasheet(PDF) 385 Page - Texas Instruments

Part # TDA2SA
Description  TDA2x ADAS Applications Processor 23mm Package (ABC Package) Silicon Revision 2.0
PDF  427 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

TDA2SA Datasheet(HTML) 385 Page - Texas Instruments

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385
TDA2SX, TDA2SG, TDA2SA
TDA2HG, TDA2HV, TDA2HF, TDA2LF
www.ti.com
SPRS951F – DECEMBER 2015 – REVISED MAY 2019
Submit Documentation Feedback
Product Folder Links: TDA2SX TDA2SG TDA2SA TDA2HG TDA2HV TDA2HF TDA2LF
Applications, Implementation, and Layout
Copyright © 2015–2019, Texas Instruments Incorporated
8.7.2.2.2 Compatible JEDEC DDR2 Devices
Table 8-31 shows the parameters of the JEDEC DDR2 devices that are compatible with this interface.
Generally, the DDR2 interface is compatible with x16 DDR2-800 speed grade DDR2 devices.
Table 8-31. Compatible JEDEC DDR2 Devices (Per Interface)
NO.
PARAMETER
MIN
MAX
UNIT
CJ21
JEDEC DDR2 device speed grade(1)
DDR2-800
CJ22
JEDEC DDR2 device bit width
x16
x16
Bits
CJ23
JEDEC DDR2 device count(2)
1
2
Devices
CJ24
JEDEC DDR2 device ball count(3)
84
92
Balls
(1) Higher DDR2 speed grades are supported due to inherent JEDEC DDR2 backwards compatibility.
(2) One DDR2 device is used for a 16-bit DDR2 memory system. Two DDR2 devices are used for a 32-bit DDR2 memory system.
(3) The 92-ball devices are retained for legacy support. New designs will migrate to 84-ball DDR2 devices. Electrically, the 92- and 84-ball
DDR2 devices are the same.
8.7.2.2.3 PCB Stackup
The minimum stackup required for routing the Device is a six-layer stackup as shown in Table 8-32.
Additional layers may be added to the PCB stackup to accommodate other circuitry or to reduce the size
of the PCB footprint.
Table 8-32. Minimum PCB Stackup
LAYER
TYPE
DESCRIPTION
1
Signal
Top routing mostly horizontal
2
Plane
Ground
3
Plane
Power
4
Signal
Internal routing
5
Plane
Ground
6
Signal
Bottom routing mostly vertical



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