MP5611

– 2.9V TO 5.2V INPUT, TRIPLE-OUTPUT, AMOLED POWER SUPPLY

MP5611 Rev. 1.0

MonolithicPower.com

16

12/16/2021

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PCB Layout Guidelines

Efficient PCB layout and placement of the high-

frequency switching path are critical to prevent

noise and electromagnetic interference (EMI).

For the best results, refer to Figure 4 and follow

the guidelines below:

1. Place the input capacitors on PVIN and AVIN

as close as possible to the device.

2. Place the output capacitors on AVDD,

ELVDD, and ELVSS as close as possible to

the device.

3. Use short and wide traces to connect the

input capacitors on PVIN and AVIN.

4. Use short and wide traces to connect the

output capacitors on AVDD, ELVDD, and

ELVSS.

5. Connect the CT capacito

r’s negative terminal

directly to the AGND pin.

6. Keep the loop between SW2, L2, the PVIN

input capacitor, the ELVSS output capacitor,

and GND as short as possible due to the

high-frequency pulse current.

7. Connect

the IC’s exposed thermal pad to

AGND, PGND1, and PGND2.

1

2

3

4

12

11

10

9

SW1

PGND1

ELVDD

FB

PVIN

SW2

ELVSS

CTRL

GND

VIN

VIN

GND

AVDD

Top

Bottom

L1

L3

L2

C1

C2

C3

C5

C4

C7

C6

C8

D1

Figure 4: Recommended PCB Layout