AM62A7 datasheet(90/247 Pages) TI2

90 / 247 page

6.10 Thermal Resistance Characteristics

This section provides the thermal resistance characteristics used on this device.

For reliability and operability concerns, the maximum junction temperature of the device has to be at or below

the TJ value identified in Section 6.5, Recommended Operating Conditions.

6.10.1 Thermal Resistance Characteristics for AMB and ANF Packages

It is recommended to perform thermal simulations at the system level with the worst case device power consumption.

NO.

PARAMETER

DESCRIPTION

AMB

PACKAGE

°C/W(1) (2)

ANF

PACKAGE

°C/W(1) (2)

AIR FLOW

(m/s)(3)

RΘJC

Junction-to-case

0.77

0.68

N/A

RΘJB

Junction-to-board

3.3

3.22

N/A

RΘJA

Junction-to-free air

12.5

12.3

Junction-to-moving air

8.6

8.5

7.6

7.0

ΨJT

Junction-to-package top

0.39

0.41

0.44

0.42

0.45

T10

0.43

0.46

T11

ΨJB

Junction-to-board

3.1

T12

2.8

2.7

T13

2.7

2.6

T14

2.6

(1)

°C/W = degrees Celsius per watt.

(2)

These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on

a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these

EIA/JEDEC standards:

•

JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)

•

JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)

•

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-9, Test Boards for Area Array Surface Mount Packages

(3)

m/s = meters per second.

6.11 Temperature Sensor Characteristics

This section summarizes the Voltage and Temperature Module (VTM) on die temperature sensor characteristics.

For operation and reliability concerns, the maximum junction temperature of the device must be equal to or less

than the TJ value identified in Recommended Operating Conditions.

Table 6-3. VTM Die Temperature Sensor Characteristics

PARAMETER

TEST

CONDITIONS

MIN

TYP

MAX

UNIT

Tacc

VTM temperature sensor accuracy

–40

℃ to 125℃

–5

℃

AM62A7, AM62A7-Q1, AM62A3, AM62A3-Q1, AM62A1-Q1

SPRSP77D – MARCH 2023 – REVISED JUNE 2025

www.ti.com

Submit Document Feedback

Product Folder Links: AM62A7 AM62A7-Q1 AM62A3 AM62A3-Q1 AM62A1-Q1

AM62A7 Datasheet(PDF) 90 Page - Texas Instruments

AM62A7 Datasheet(HTML) 90 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datasheet Download

Link URL