ZIOL2201 datasheet(63/92 Pages) RENESAS

63 / 92 page

ZIOL2xxx Datasheet

April 26, 2016

•

In order to achieve an optimal heat distribution form the IC to the environment it is strongly

recommended to place via’s underneath the QFN package. An example as regards this PCB design

detail is illustrated in Figure 4.4 (2-layer PCB example). Please refer to applications notes of the

package manufacturer AMKOR for more details how to place cooling via’s underneath the IC package

(please visit the link mentioned in chapter 8, [4]).

Figure 4.4

PCB Layout Recommendations

ZIOL2401

AUX_EN

AUX_TX

WURQ

TX_EN

INT_L

RST_L

M_EN

VDD

COM_O

VSS

LR_IN

LR_OUT

COM_I

AUX_O

Vout = 5V

DC_RDY

AUX_I

AUX_RX

R2/R1

ZIOL

2401

Schottky Diode

TMMBAT42

10µH

(close to pin 21 of ZIOL2401)

38.3KW

( DC/DC converter output

12.4KW

voltage Vout = 5V )

10µF / 10V (low ESR)

100nF

10µF / 10V (low ESR)

100nF

10µF / 50V (low ESR)

100nF

Application

Example

2-layer PCB

4-layer PCB

Cooling

Via’s

ZIOL2201 Datasheet(PDF) 63 Page - Renesas Technology Corp

ZIOL2201 Datasheet(HTML) 63 Page - Renesas Technology Corp

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