ZIOL2201 datasheet(67/92 Pages) RENESAS

67 / 92 page

ZIOL2xxx Datasheet

April 26, 2016

Package

6.1. Package Details QFN24 4x4mm

6.1.1.

Pin Hardware Configurations

In contrast to the integrated circuit product ZIOL2xxx which is base IC for the ZIOL2xxx IC family, not all derived

ICs provide all electrical pin interconnections as provided with the ZIOL2xxx. Table 6.1 shows what pins are not

connected (n.c.).

Table 6.1

Availability of Pin Interconnections

Number

(QFN

package)

Name

ZIOL

240x

2) 3)

ZIOL

241x

2) 3)

ZIOL

220x

2) 3)

ZIOL

221x

2) 3)

ZIOL

210x

2) 3)

ZIOL

211x

2) 3)

PCB Design

Recommendations

for not connected

(n.c.) Pins

COM_I

n.c.

Connect to VSS

COM_O

n.c.

Connect to VSS

AUX_I

n.c.

Connect to VSS

AUX_O

n.c.

Connect to VSS

n.c.

Do not connect

n.c.

Do not connect

2) “+”:

Pin is in connected, regular use as mentioned in this datasheet

3) “n.c.”: Pin is not connected, the PC design recommendations shall be considered

6.1.2.

Pin Diagram

The standard package of the ZIOL2xxx is a “sawn type” 24 pin MicroLeadFrame package (Amkor, QFN24): It is a

green package having a 4mm body width and a lead pitch of 0.5 mm (refer to [3] in chapter 8).

With respect to the different pin hardware configurations of certain ICs of the product family ZIOL2xxx not all pins

are interconnected with the silicon die (for more information refer to Table 6.1). The pin diagram shown in Figure

6.1 does not reflect this or can be considered as the pin diagram of the ZIOL2xxx.

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