DRA752ABC datasheet(195/443 Pages) TI2

195 / 443 page

Device

rtc_osc_xo

rtc_osc_xi_clkin32

Crystal

(Optional)

xi_osc1

CK0

CK1

195

DRA756, DRA755, DRA754, DRA752

DRA751, DRA750, DRA746, DRA745, DRA744

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SPRS950F – DECEMBER 2015 – REVISED MAY 2019

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Clock Specifications

Table 6-8. OSC1 Input Clock Timing Requirements (continued)

NAME

DESCRIPTION

MIN

TYP

MAX

UNIT

tj(xiosc1)

Frequency accuracy(2), xi_osc1

Ethernet and MLB not used

±200

ppm

Ethernet RGMII and RMII

using derived clock

±50

Ethernet MII using derived

clock

±100

MLB using derived clock

±50

(1) Period jitter is meant here as follows:

–

The maximum value is the difference between the longest measured clock period and the expected clock period

–

The minimum value is the difference between the shortest measured clock period and the expected clock period

(2) Crystal characteristics should account for tolerance+stability+aging.

(3) The Period jitter requirement for osc1 can be relaxed to 0.02*tc(xiosc1) under the following constraints:

a.The osc1/SYS_CLK2 clock bypasses all device PLLs

b.The osc1/SYS_CLK2 clock is only used to source the DSS pixel clock outputs

Figure 6-9. xi_osc1 Input Clock

6.1.4

RTC Oscillator Input Clock

FUNC_32K_CLK is received directly from RTC Oscillator. For more information about FUNC_32K_CLK

see Device TRM, Chapter: Power, Reset, and Clock Management.

6.1.4.1

RTC Oscillator External Crystal

An external crystal is connected to the device pins. Figure 6-2 describes the crystal implementation.

Figure 6-10. Crystal Implementation

NOTE

The load capacitors, Cf1 and Cf2 in Figure 6-10, should be chosen such that the below

equation is satisfied. CL in the equation is the load specified by the crystal manufacturer. All

discrete components used to implement the oscillator circuit should be placed as close as

possible to the associated oscillator rtc_osc_xi_clkin32 and rtc_osc_xo pins.

DRA752ABC Datasheet(PDF) 195 Page - Texas Instruments

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