Analog Integrated Circuit Device Data



Freescale Semiconductor

5

33883

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Power Dissipation and Thermal Characteristics

Maximum Power Dissipation @ 25°C

Thermal Resistance (Junction to Ambient)

Operating Junction Temperature

Storage Temperature

PD

RJA

TJ

TSTG

1.25

100

-40 to 150

-65 to 150

W

°C/W

°C

°C

Peak Package Reflow Temperature During Reflow (4), (5)

TPPRT

Note 5

°C

Notes

4.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

5.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL),



Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.

MC33xxxD enter 33xxx), and review parametrics.

Table 2. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Rating

Symbol

Value

Unit