ADuCM320

Data Sheet

Rev. C | Page 30 of 30

PACKAGING AND ORDERING INFORMATION

OUTLINE DIMENSIONS

Figure 16. 96-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

(BC-96-2)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

Ordering Quantity

ADuCM320BBCZ

−40°C to +105°C

96-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

BC-96-2

429

ADuCM320BBCZ-RL

−40°C to +105°C

96-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

BC-96-2

2,500

EV-ADuCM320QSPZ

Evaluation Board with QuickStart Development System

1

1

Z = RoHS Compliant Part.

I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).

6.10

6.00 SQ

5.90

5.00 REF

SQ

0.35

0.30

0.25

COPLANARITY

0.08

A

B

C

D

E

F

G

H

J

K

L

7 6

3 2 1

5 4

BALL DIAMETER

0.50

BSC

0.50

REF

DETAIL A

A1 BALL

CORNER

A1 BALL

CORNER

DETAIL A

BOTTOM VIEW

TOP VIEW

SEATING

PLANE

1.200

1.083

1.000

8

9

10

11

COMPLIANT TO JEDEC STANDARDS MO-195-AC

WITH THE EXCEPTION TO BALL COUNT.

0.223 NOM

0.173 MIN

0.93

0.86

0.79

©2014–2015 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D12272-0-10/15(C)

www.analog.com/ADuCM320