MAX8521 datasheet(2/18 Pages) MAXIM

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Smallest TEC Power Drivers for Optical

Modules

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ABSOLUTE MAXIMUM RATINGS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

VDD to GND ..............................................................-0.3V to +6V

SHDN, MAXV, MAXIP, MAXIN,

CTLI to GND .........................................................-0.3V to +6V

COMP, FREQ, OS1, OS2, CS, REF,

ITEC to GND...........................................-0.3V to (VDD + 0.3V)

PVDD1, PVDD2 to GND...............................-0.3V to (VDD + 0.3V)

PVDD1, PVDD2 to VDD ...........................................-0.3V to +0.3V

PGND1, PGND2 to GND .......................................-0.3V to +0.3V

COMP, REF, ITEC short to GND....................................Indefinite

LX Current (Note 1) ........................................±2.25A LX Current

Continuous Power Dissipation (TA = +70°C)

6 x 6 UCSP (derate 22mW/°C above +70°C) ...............1.75W

20-Pin 5mm x 5mm x 0.9mm TQFN (derate 20.8mW/°C

above +70°C) (Note 2)...................................................1.67W

36-Bump WLP (derate 22mW/°C above +70°C)............1.75W

Operating Temperature Range ...........................-40°C to +85°C

Maximum Junction Temperature .....................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

ELECTRICAL CHARACTERISTICS

(VDD = VPVDD1 = VPVDD2 = VSHDN = 5V, 1MHz mode (Note 3). PGND1 = PGND2 = GND, CTLI = MAXV = MAXIP = MAXIN = REF,

TA = 0°C to +85°C, unless otherwise noted. Typical values at TA = +25°C.)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Input Supply Range

VDD

3.0

5.5

Maximum TEC Current

±1.5

Reference Voltage

VREF

VDD = 3V to 5.5V, IREF = 150µA

1.485

1.500

1.515

Reference Load Regulation

∆VREF

VDD = 3V to 5V, IREF = 10µA to 1mA

1.2

5.0

VMAXI_ = VREF

140

150

160

VDD = 5V

VMAXI_ = VREF/3

VMAXI_ = VREF

143

150

155

MAXIP/MAXIN Threshold

Accuracy

VDD = 3V

VMAXI_ = VREF/3

VDD = 5V, I = 0.2A

0.09

0.14

NFET On-Resistance

RDS(ON-N)

VDD = 3V, I = 0.2A

0.11

0.16

Ω

VDD = 5V, I = 0.2A

0.14

0.23

PFET On-Resistance

RDS(ON-P)

VDD = 3V, I = 0.2A

0.17

0.30

Ω

VLX = VDD = 5V, TA = +25

°C

0.03

4.00

NFET Leakage

ILEAK(N)

VLX = VDD = 5V TA = +85

°C

0.3

µA

VLX = 0, TA = +25

°C

0.03

4.00

PFET Leakage

ILEAK(P)

VLX = 0, TA = +85

°C

0.3

µA

500kHz mode

VCOMP = VREF =

1.500V, VDD = 5V

1MHz mode

500kHz mode

No-Load Supply Current

IDD(NO

LOAD)

VCOMP = VREF =

1.500V, VDD = 3.3V

1MHz mode

Shutdown Supply Current

IDD-SD

SHDN = GND, VDD = 5V, (Note 4)

Thermal Shutdown

TSHUTDOWN Hysteresis = 15

°C

+165

°C

VDD rising

2.50

2.65

2.80

UVLO Threshold

VUVLO

VDD falling

2.40

2.55

2.70

Note 1: LX has internal clamp diodes to PGND and PVDD. Applications that forward bias these diodes should take care not to

exceed the IC’s package power dissipation limits.

Note 2: Solders underside metal slug to PCB ground plane.

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