PCF2123 datasheet(38/54 Pages) NXP

38 / 54 page

PCF2123_1

Product data sheet

Rev. 01 — 19 November 2008

38 of 54

NXP Semiconductors

PCF2123

SPI Real time clock/calendar

10. Limiting values

[1]

With respect to VSS.

[2]

Pass level; Human Body Model (HBM) according to JESD22-A114.

[3]

Pass level; Machine Model (MM), according to JESD22-A115

[4]

Pass level; latch-up testing, according to JESD78.

[5]

According to the NXP store and transport conditions (document

SNW-SQ-623) the devices have to be

stored at a temperature of +5

°C to +45 °C and a humidity of 25 % to 75 %.

Table 43.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

VDD

supply voltage

[1]

−0.5

+6.5

IDD

supply current

−50

+50

input voltage

[1]

−0.5

+6.5

output voltage

[1]

−0.5

+6.5

input current

−10

+10

output current

−10

+10

Ptot

total power dissipation

300

Tamb

ambient temperature

−40

+85

°C

Vesd

electrostatic discharge

voltage

HBM

[2] -

±3000 V

[3] -

±300

Ilu

latch-up current

[4] -

200

Tstg

storage temperature

[5]

−65

+150

°C

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