ADP3210 datasheet(35/38 Pages) ONSEMI

35 / 38 page

ADP3210

Rev. 0.3 | Page 35 of 38

It is important for conversion efficiency that MOSFET drivers,

such as ADP3419, are placed as close to the MOSFETs as

possible. Thick and short traces are required between the driver

and MOSFET gate, especially for the SR MOSFETs. Ground the

MOSFET driver’s GND pin through immediately close vias.

Signal Circuitry

The output voltage is sensed and regulated between the FB pin

and the FBRTN pin, which connects to the signal ground at the

load. To avoid differential mode noise pickup in the sensed

signal, the loop area should be small. Thus, route the FB and

FBRTN traces adjacent to each other atop the power ground

plane back to the controller. To filter any noise from the FBRTN

trace, using a 1000 pF MLCC is suggested. It should be placed

between the FBRTN pin and local ground and as close to the

FBRTN pin as possible.

Connect the feedback traces from the switch nodes as close as

possible to the inductor. The CSREF signal should be Kelvin

connected to the center point of the copper bar, which is the

VCORE common node for the inductors of all phases.

In the back side of the ADP3210 package, a metal pad can be

used as the device heat sink. In addition, running vias under the

ADP3210 is not recommended because the metal pad can cause

shorting between vias.

ADP3210 Datasheet(PDF) 35 Page - ON Semiconductor