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LPC2103 Datasheet(PDF) 24 Page - NXP Semiconductors

Part # LPC2103
Description  Single-chip 16-bit/32-bit microcontrollers; 8 kB/16 kB/32 kB flash with ISP/IAP, fast ports and 10-bit ADC
PDF  37 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

LPC2103 Datasheet(HTML) 24 Page - NXP Semiconductors

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LPC2101_02_03_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 2 June 2009
24 of 37
NXP Semiconductors
LPC2101/02/03
Single-chip 16-bit/32-bit microcontrollers
Ipu
pull-up current
VI =0V
[13]
−15
−50
−85
µA
VDD(3V3) <VI <5V[12]
00
0
µA
IDD(CORE) core supply current
Active mode;
code
while(1){}
executed from flash; all peripherals
enabled via PCONP register but not
configured to run; CCLK = 70 MHz
VDD(1V8) = 1.8 V; Tamb =25 °C
-
41
70
mA
Power-down mode;
VDD(1V8) = 1.8 V; Tamb =25 °C
-
2.5
25
µA
VDD(1V8) = 1.8 V; Tamb =85 °C
-
35
105
µA
Deep power-down mode;
RTC off; SRAM off; Tamb =25 °C
Vi(VBAT) = 3.3 V; VDD(1V8) = 1.8 V
-
0.7
-
µA
IBAT
battery supply
current
Active mode; CCLK = 70 MHz;
PCLK = 17.5 MHz;
PCLK enabled to RTCK;
RTC clock = 32 kHz (from RTCX
pins); Tamb =25 °C
[14]
VDD(1V8) = 1.8 V; Vi(VBAT) = 3.0 V
-
10
15
µA
Power-down mode;
RTC clock = 32 kHz
(from RTCX pins); Tamb =25 °C
VDD(1V8) = 1.8 V; Vi(VBAT) = 2.5 V
-
7
12
µA
VDD(1V8) = 1.8 V; Vi(VBAT) = 3.0 V
-
8
12
µA
Deep power-down mode;
RTC off; SRAM off; Tamb =25 °C
VDD(1V8) = 1.8 V; Vi(VBAT) = 3.0 V
-
8
-
µA
I2C-bus pins
VIH
HIGH-level input
voltage
0.7VDD(3V3)
--
V
VIL
LOW-level input
voltage
-
-
0.3VDD(3V3) V
Vhys
hysteresis voltage
-
0.5VDD(3V3) -V
VOL
LOW-level output
voltage
IOLS =3mA
[10] -
-
0.4
V
ILI
input leakage
current
VI =VDD(3V3)
-2
4
µA
VI =5V
[15] -10
22
µA
Oscillator pins
Vi(XTAL1)
input voltage on pin
XTAL1
0
-
1.8
V
Table 5.
Static characteristics …continued
Tamb= −40 °C to +85 °C for commercial applications, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit



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