LPC2103 datasheet(35/37 Pages) NXP

35 / 37 page

LPC2101_02_03_4

Product data sheet

Rev. 04 — 2 June 2009

35 of 37

NXP Semiconductors

LPC2101/02/03

Single-chip 16-bit/32-bit microcontrollers

13. Revision history

Table 9.

Revision history

Document ID

Release date

Data sheet status

Change

notice

Supersedes

LPC2101_02_03_4

20090602

Product data sheet

LPC2101_02_03_3

Modiﬁcations:

• Section 6.17.4 “Code security (Code Read Protection - CRP)”: added description of three

CRP levels (applicable to Revision A and higher).

• Section 6.17.7 “Power control”: added description of Deep power-down mode (applicable to

Revision A and higher).

• Section 10.1 “XTAL1 input” added.

• Section 10.2 “XTAL and RTC Printed Circuit Board (PCB) layout guidelines” added.

• Figure 6, Figure 7, Figure 8: added power consumption data for Deep power-down mode

(applicable to Revision A and higher).

• Table 3: added table note 7.

• Table 3: modiﬁed description of P0.14, RTCX1, RTCX2, XTAL1, XTAL2, JTAG, and DBGSEL

pins.

• Table 4: modiﬁed value for VDD(3V3).

• Table 5: added and modiﬁed values for Vhys.

• Table 5: Voltage range for pins VDD(3V3) and VDDA extended to 2.6 V.

LPC2101_02_03_3

20081007

Product data sheet

LPC2101_02_03_2

Modiﬁcations:

• Updated data sheet status to Product data sheet.

• Table 1 and Table 2: added LPC2102FHN48 and LPC2103FHN48.

• Table 1, Table 2, Table 3 and related ﬁgures: removed LPC2103FA44.

• Table 3: updated pad descriptions.

• Table 3: updated description of pin 47, SCL1.

• Table 3: updated description of pins VDDA and VDD(1V8).

• Table 4: changed storage temperature range from

−40 °C/125 °C to −65 °C/150 °C.

• Table 5: added or modiﬁed values for IDD(act), IDD(pd), IBATpd, IBATact.

• Table 5: removed “CCLK = 10 MHz” and associated values for IDD(act).

• Section 5: added Figure 3.

• Section 11: added Figure 11.

LPC2101_02_03_2

20071218

Preliminary data sheet

LPC2101_02_03_1

20060118

Preliminary data sheet

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