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TPS23754PWPR Datasheet(PDF) 21 Page - Texas Instruments

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Part # TPS23754PWPR
Description  High Power/High Efficiency PoE Interface and DC/DC Controller
PDF  41 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TPS23754PWPR Datasheet(HTML) 21 Page - Texas Instruments

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background image
t-Time-200 s/div
m
I PI
16VInputstep
V RTN-VSS
V VDD-VSS
CIN completescharge
whileconverteroperates
RecoveryfromPIdropout
VRTN <12V@400 s
m
TPS23754
TPS23754-1
TPS23756
www.ti.com
SLVS885D – OCTOBER 2008 – REVISED DECEMBER 2009
PD Hotswap Operation
IEEE 802.3at has taken a new approach to PSE output limiting. A type 2 PSE must meet an output current vs.
time template with specified minimum and maximum sourcing boundaries. The peak output current may be as
high as 50 A for 10
μs or 1.75 A for 75 ms. This makes robust protection of the PD device even more important
than it was in IEEE 802.3-2008.
The internal hotswap MOSFET is protected against output faults and input voltage steps with a current limit and
deglitched (time-delay filtered) foldback. An overload on the pass MOSFET engages the current limit, with
VRTN-VVSS rising as a result. If VRTN rises above ~12 V for longer than ~400 μs, the current limit reverts to the
inrush value, and turns the converter off. The 400
μs deglitch feature prevents momentary transients from
causing a PD reset, provided that recovery lies within the bounds of the hotswap and PSE protection. Figure 26
shows an example of recovery from a 16 V PSE rising voltage step. The hotswap MOSFET goes into current
limit, overshooting to a relatively low current, recovers to ~950 mA full current limit, and charges the input
capacitor while the converter continues to run. The MOSFET did not go into foldback because VRTN-VVSS was
below 12 V after the 400
μs deglitch.
Figure 26. Response to PSE Step Voltage
The PD control has a thermal sensor that protects the internal hotswap MOSFET. Conditions like startup or
operation into a VDD to RTN short cause high power dissipation in the MOSFET. An over-temperature shutdown
(OTSD) turns off the hotswap MOSFET and class regulator, which are restarted after the device cools. The
hotswap MOSFET will be re-enabled with the inrush current limit when exiting from an over-temperature event.
Pulling DEN to VSS during powered operation causes the internal hotswap MOSFET to turn off. This feature
allows a PD with Option three ORing per Figure 27 to achieve adapter priority. Care must be taken with
synchronous converter topologies that can deliver power in both directions.
The hotswap switch will be forced off under the following conditions:
1. VAPD above VAPDEN (~1.5 V)
2. VDEN < VPD-DIS when VVDD– VVSS is in the operational range
3. PD over-temperature
4. (VVDD– VVSS) < PoE UVLO (~30.5 V).
Converter Controller Features
The TPS23754 dc/dc controller implements a typical current-mode control as shown in the Functional Block
Diagram. Features include oscillator, over-current and PWM comparators, current-sense blanker, dead-time
control, softstart, and gate driver. In addition, an internal slope-compensation ramp generator, frequency
synchronization logic, thermal shutdown, and startup current source with control are provided.
Copyright © 2008–2009, Texas Instruments Incorporated
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