BLF871_2

© NXP B.V. 2009. All rights reserved.

Preliminary data sheet

Rev. 02 — 5 March 2009

11 of 18

NXP Semiconductors

BLF871

UHF power LDMOS transistor

8.

Test information

[1]

American technical ceramics type 100B or capacitor of same quality.

[2]

American technical ceramics type 180R or capacitor of same quality.

[3]

American technical ceramics type 100A or capacitor of same quality.

[4]

Printed-Circuit Board (PCB): Rogers 5880;

ε

thickness copper plating = 35

µm.

Table 9.

List of components

For test circuit, see Figure 14, Figure 15 and Figure 16.

Component

Description

Value

Remarks

C1, C2

multilayer ceramic chip capacitor

5.1 pF

[1]

C3, C4

multilayer ceramic chip capacitor

10 pF

[2]

C5

multilayer ceramic chip capacitor

6.8 pF

[1]

C6

multilayer ceramic chip capacitor

4.7 pF

[1]

C7

multilayer ceramic chip capacitor

2.7 pF

[1]

C8, C9, C10, C25,

C26

multilayer ceramic chip capacitor

100 pF

[1]

C11, C27

multilayer ceramic chip capacitor

10

µF

TDK C570X7R1H106KT000N or

capacitor of same quality.

C12

electrolytic capacitor

470

µF; 63 V

C20

multilayer ceramic chip capacitor

10 pF

[3]

C21

multilayer ceramic chip capacitor

8.2 pF

[3]

C22

trimmer

0.6 pF to 4.5 pF

Tekelec

C23

multilayer ceramic chip capacitor

6.8 pF

[3]

C24

multilayer ceramic chip capacitor

3.9 pF

[3]

L1

stripline

-

[4]

(W

× L) 7 mm × 15 mm

L2

stripline

-

[4]

(W

× L) 2.4 mm × 9mm

L3

stripline

-

[4]

(W

× L) 2.4 mm × 10 mm

L4

stripline

-

[4]

(W

× L) 2.4 mm × 25 mm

L5

stripline

-

[4]

(W

× L) 2.4 mm × 10 mm

L6

stripline

-

[4]

(W

× L) 2.0 mm × 20 mm

L7

stripline

-

[4]

(W

× L) 2.0 mm × 21 mm

L20

stripline

-

[4]

(W

× L) 7 mm × 12 mm

L21

stripline

-

[4]

(W

× L) 2.4 mm × 13 mm

L22

stripline

-

[4]

(W

× L) 2.4 mm × 31 mm

L23

stripline

-

[4]

(W

× L) 2.4 mm × 5mm

R1

resistor

100

Ω

R2

resistor

10 k

Ω