Sensors

6

Freescale Semiconductor

MMA690xQ

1.5

EXTERNAL COMPONENTS

The connections illustrated in Figure 1-5 are recommended. Careful printed wiring board layout and component placement is

ed land area with solder mask should be placed under the package for improved shielding of the device from external effects. If

a land area is not provided, no signals should be routed beneath the package.

Figure 1-5 External Components

1

μF

100 nF

100 nF

1

μF

MMA690xQ

100 nF

1.0

μF

MMA690xQ

100 nF

1.0

μF

100 nF

1.0

μF

RECOMMENDED EXTERNAL COMPONENT CONFIGURATION

ALTERNATE EXTERNAL COMPONENT CONFIGURATION