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33480 Datasheet(PDF) 5 Page - Freescale Semiconductor, Inc |
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33480 Datasheet(HTML) 5 Page - Freescale Semiconductor, Inc |
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5 / 39 page ![]() Analog Integrated Circuit Device Data Freescale Semiconductor 5 33480 MAXIMUM RATINGS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit ELECTRICAL RATINGS Overvoltage Test Range (all OUT[1:5] ON with nominal DC current) 2.0 Hours @ 25°C 1.0 Min @ 25°C Load Dump (400 ms) @ 25°C VBAT 20 27 40 V Reverse Polarity Voltage Range (all OUT[1:5] ON with nominal DC current) 2.0 Min @ 25°C VBAT -15 V VCC Supply Voltage VCC -0.3 to 5.5 V OUT[1:5] Voltage Positive Negative (ground disconnected) VOUT 40 -16 V Digital Input Current in Clamping Mode (SI, SCLK, CS, IGN, FLASHER, LIMP) IIN 5.0 mA SO and FETOUT Outputs Voltage VSO -0.3 to VCC+0.3 V FETin Input Current IFETin 10 mA Outputs clamp energy using single pulse method (L=2mH; R=0; Vbat=14V @150°C initial) OUT[1,5] OUT[2:4] E1,5 E2,3,4 85 300 mJ ESD Voltage (2) Human Body Model (HBM) Human Body Model (HBM) OUT [1:5] Charge Device Model (CDM) VESD ±2kV ±8kV TBD V THERMAL RATINGS Operating Temperature Ambient Junction TA TJ -40 to 125 -40 to 150 °C Peak Terminal Re-flow Temperature During Solder Mounting (3) TSOLDER 260 °C Storage Temperature TSTG -55 to 150 °C THERMAL RESISTANCE Thermal Resistance, Junction to Case (4) RθJC 1.0 °K/W Notes 2. ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω) and the Charge Device Model. 3. Terminal soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. If the qualification fails, TSOLDER will be changed for 240°C. 4. Typical value guaranteed per design. |
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