33894 datasheet(5/28 Pages) FREESCALE

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Analog Integrated Circuit Device Data

Freescale Semiconductor

33894

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Ratings

Symbol

Value

Unit

ELECTRICAL RATINGS

Operating Voltage Range

Steady-State

VPWR(SS)

-16 to 41

VDD Supply Voltage

VDD

0 to 5.5

Input/Output Voltage (1)

VIN[0:3], RST,

FSI, CSNS, SI,

SCLK, CS, FS

-0.3 to 7.0

SO Output Voltage (1)

VSO

-0.3 to VDD+0.3

WAKE Input Clamp Current

ICL(WAKE)

2.5

CSNS Input Clamp Current

ICL(CSNS)

Output Current (2)

IHS[0:3]

Output Clamp Energy (3)

ECL[0:3]

TBD

ESD Voltage (4)

Human Body Model

Machine Model

VESD1

VESD2

±2000

±200

THERMAL RATINGS

Operating Temperature

Ambient

Junction

-40 to 125

-40 to 150

°C

Storage Temperature

TSTG

-55 to 150

°C

Thermal Resistance (5)

Junction to Case

Junction to Ambient

RθJC

RθJA

<1.0

TBD

°C/W

Peak Pin Reflow Temperature During Solder Mounting (6)

TSOLDER

240

°C

Notes

Exceeding voltage limits on IN[0:3], RST, FSI, CSNS, SI, SO, SCLK, CS, or FS pins may cause a malfunction or permanent damage to

the device.

Continuous high-side output current rating so long as maximum junction temperature is not exceeded. Calculation of maximum output

current using package thermal resistance is required.

Active clamp energy using single-pulse method (L = 16 mH, RL = 0 Ω, VPWR = 12 V, TJ = 150°C).

ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), ESD2 testing is performed in

accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω) and in accordance with the system module specification with a

capacitor > 0.01

µF connected from high-side outputs to GND.

Device mounted on a 2s2p test board per JEDEC JESD51-2.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

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