AD5757ACPZ datasheet(9/44 Pages) AD

9 / 44 page

AD5757

Rev. A | Page 9 of 44

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted. Transient currents of up to

100 mA do not cause SCR latch-up.

Table 4.

Parameter

Rating

AVDD, VBOOST_x to AGND, DGND

−0.3 V to +33 V

AVCC to AGND

−0.3 V to +7 V

DVDD to DGND

−0.3 V to +7 V

Digital Inputs to DGND

−0.3 V to DVDD + 0.3 V or +7 V

(whichever is less)

Digital Outputs to DGND

−0.3 V to DVDD + 0.3 V or +7 V

(whichever is less)

REFIN, REFOUT to AGND

−0.3 V to AVDD + 0.3 V or +7 V

(whichever is less)

IOUT_x to AGND

AGND to VBOOST_x or 33 V if using

the dc-to-dc circuitry

SWx to AGND

−0.3 V to +33 V

AGND, GNDSWx to DGND

−0.3 V to +0.3 V

Operating Temperature Range (TA)

Industrial1

−40°C to +105°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature (TJ max)

125°C

64-Lead LFCSP

θJA Thermal Impedance2

20°C/W

Power Dissipation

(TJ max – TA)/θJA

Lead Temperature

JEDEC industry standard

Soldering

J-STD-020

1 Power dissipated on chip must be derated to keep the junction temperature

below 125°C.

2 Based on a JEDEC 4-layer test board.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION

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