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LPC178X Datasheet(PDF) 70 Page - NXP Semiconductors |
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LPC178X Datasheet(HTML) 70 Page - NXP Semiconductors |
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70 / 117 page  LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Objective data sheet Rev. 2 — 27 May 2011 70 of 117 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller 9. Thermal characteristics 9.1 Thermal characteristics The average chip junction temperature, TJ (C), can be calculated using the following equation: (1) • Tamb = ambient temperature (C), • Rth(j-a) = the package junction-to-ambient thermal resistance (C/W) • PD = sum of internal and I/O power dissipation The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of the I/O pins is often small and many times can be negligible. However it can be significant in some applications. T J T amb P D R th j a – + = Table 10. Thermal characteristics VDD = 2.4 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified; Symbol Parameter Conditions Min Typ Max Unit Tj(max) maximum junction temperature --125 C |
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