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BGA7210 Datasheet(PDF) 11 Page - NXP Semiconductors

Part # BGA7210
Description  700 MHz to 3800 MHz high linearity variable gain amplifier
PDF  30 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BGA7210 Datasheet(HTML) 11 Page - NXP Semiconductors

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BGA7210
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 2 — 4 January 2012
11 of 30
NXP Semiconductors
BGA7210
700 MHz to 3800 MHz high linearity variable gain amplifier
11. Application information
11.1 Application board
A customer application board is available from NXP upon request. It includes USB
interface circuitry and customer software to facilitate evaluation of the BGA7210.
The final application shall be terminated with 50
 and decoupled as depicted in Figure 7.
The ground leads and exposed paddle should be connected directly to the ground plane.
A sufficient number of via holes should be provided to connect the top and bottom ground
planes in the final application board. Sufficient cooling should be provided that the
temperature of the exposed die pad does not exceed 85
C.
See Table 14 for list of components.
Fig 7.
Schematic representation of the customer evaluation board
aaa-000665
C23
C1
C26
C25
L2
RF_OUT
Csh
L1
C24
C27
C22
C12
C14
19
20
17
16
15
12
29
VDDA
VCC1
VDDD
SEROUT
SERIN
CLK
PUPMXG/
PWRDN
SS
VCC2
RF_OUT
RF_IN
C18
VSUP
C17
21
22
23
24
Table 14.
List of components
See Figure 7 for schematics.
Component
Description
Value
Remarks
C1, C27
DC blocking capacitor
100 pF
Murata GRM
C12
decoupling capacitor
100 nF
close to pin 19
C14
decoupling capacitor
100 nF
close to pin 17
C17
decoupling capacitor
100 nF
close to pin 15
C18
decoupling capacitor
100 nF
close to pin 16
C22
optional decoupling capacitor
10
F
part of optional ripple filter
C23
optional decoupling capacitor
10
F
part of optional ripple filter
C24
decoupling capacitor
100 pF
C25
decoupling capacitor
100 nF



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